Detection of an end point of polishing a substrate

Details Detection of an end point of polishing a substrate Detection of an end point of polishing a substrate

2006-02-21

2006-02-21

Ahmed, Samir (Department: 2623)

Image analysis

Applications

Manufacturing or product inspection

C451S006000, C438S014000, C438S959000

Reexamination Certificate

active

07003148

ABSTRACT:
A two-dimensional image of a substrate surface targeted for polishing is periodically picked up, and the image is analyzed to obtain an entropy H1, H2of the two-dimensional image. An end point of polishing is then determined according to the entropy H1, H2. Alternatively, other image characteristic value such as a difference statistic of the image may be employed instead of the entropy H1, H2.

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patent: 9-131663 (1997-05-01), None
patent: 3001051 (1999-12-01), None

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