Detection method for wire bonding failures

Details Detection method for wire bonding failures Detection method for wire bonding failures

1990-05-14

1991-10-22

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228179, H01L 21603

Patent

active

050587978

ABSTRACT:
Method for detecting failures in wire bonding is performed by applying a minimal voltage to bonding wire between the first and second bonding steps, between the second bonding step and bonding wire cutting step, and before the next first bonding step. Thus, whether or not the first bonding and the second bonding have been performed properly and whether or not the wire condition before the next first bonding is proper are all detected before advancing next bonding.

REFERENCES:
patent: 3763545 (1973-10-01), Spanjer
patent: 4441248 (1984-04-01), Sherman et al.
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4586642 (1986-05-01), Dreibelbis et al.

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