Detection method/device of probe's tip location using a...

Details Detection method/device of probe's tip location using a... Detection method/device of probe's tip location using a...

2008-07-08

2008-07-08

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090

Reexamination Certificate

active

07397257

ABSTRACT:
A method for detecting tip positions of probes which is performed prior to the wafer test includes a first step of attaching the transparent film F on the test substrate W having the electrodes P arranged same as those of the wafer; a second step of detecting the electrodes P of the test substrate W by using the first CCD camera13A; a third step of detecting a surface height of the transparent film F; a fourth step of position-aligning the electrodes P of the test substrate W with the probes12A. The method further includes a fifth step of forming the probe marks M on the transparent film F by making the probes12A contact with the transparent film F; and a sixth step of detecting tip positions of the probes12A based on the electrodes P of the test substrate W and the probe marks M.

REFERENCES:
patent: 5321352 (1994-06-01), Takebuchi
patent: 5644245 (1997-07-01), Saitoh et al.
patent: 2007/0103181 (2007-05-01), Strom

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