Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-09-05
2006-09-05
Chawan, Sheela (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S224000, C382S312000, C356S237100, C438S051000
Reexamination Certificate
active
07103208
ABSTRACT:
A method for determining blemishes in or on the transmissive surface of an image sensor package and determining if such blemishes are acceptable for use of the image sensor package including capturing a digital image of a predetermined scene using the image sensor package and storing such digital image in a memory, identifying blemishes formed in or on the transmissive surface by processing the digital image data using a series of image processing functions, and classifying the blemishes from the digital image and determining if the image sensor package is acceptable for use.
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“Solid-State Imaging with Charge-Coupled Devices” by Albert Theuwissen.
Conaway Paul D.
Wengender Timothy G.
Chawan Sheela
Owens Raymond L.
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