Detaping machine for removal of integrated circuit devices from

Details Detaping machine for removal of integrated circuit devices from Detaping machine for removal of integrated circuit devices from

1992-09-02

1993-12-07

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156344, 221 25, 221 72, 221 82, 414405, B65H 528

Patent

active

052680592

ABSTRACT:
A detaping machine is provided for removing parts from a reel of sealed pocket tape, with minimum handling of such parts. The machine has a spindle on which the sealed pocket tape is mounted. The pocket tape includes a carrier tape portion and a cover tape portion. The carrier tape is fed into the detaping machine in an inverted position; and it is guided on an upper track of the machine. The cover tape is wound on a take-up reel located beneath the upper track. As the cover tape is wound, the carrier tape is driven on the upper track between guide flanges. An aperture is located in the upper track, and it is sized to permit devices, located in the inverted pockets of the carrier tape, to drop through to a second guide track located beneath the aperture. The devices in the second guide track then may be repackaged in carrier tubes or the like, without damaging the leads and without manual handling.

REFERENCES:
patent: 4660282 (1987-04-01), Pfaff
patent: 4738386 (1988-04-01), Itemadani et al.
patent: 4915770 (1990-04-01), Haeda et al.
patent: 5148969 (1992-09-01), Boucher et al.
patent: 5213653 (1993-05-01), Akuhori et al.

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