Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-08-15
2006-08-15
Nguyen, Tuan H. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C361S688000
Reexamination Certificate
active
07091586
ABSTRACT:
An integrated circuit (IC) package that includes an on-package voltage regulation module (VRM). An IC die is flip-bounded to a substrate having a plurality of connections to couple to a socket or to be mounted directly to a circuit board. An integrated heat spreader (IHS) is thermally coupled to the IC die and coupled (both electrically and mechanically) to the substrate. A VRM is coupled to the IHS. The IHS, which serves as an interconnect member, includes interconnect provisions for electrically coupling the VRM to the substrate. In one embodiment, the body of the IHS serves as a ground plane, while a separate interconnect layer includes electrical traces for routing electrical signals between the VRM and substrate. The VRM may comprise a detachable package that is coupled to the IHS via one of several means including fasteners, edge connectors and a parallel coupler.
REFERENCES:
patent: 5734555 (1998-03-01), McMahon
patent: 5982635 (1999-11-01), Menzies et al.
patent: 6469908 (2002-10-01), Patel et al.
patent: 2002/0145839 (2002-10-01), Smith et al.
patent: WO 01/65344 (2001-09-01), None
patent: PCT/US2004/035997 (2005-05-01), None
Millik Debendra
Patel Priyavadan R.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Nguyen Tuan H.
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