Detachable module/ball grid array package

Details Detachable module/ball grid array package Detachable module/ball grid array package

1996-06-03

1997-09-09

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257678, 257737, 257686, 361729, 361733, 361776, 361803, 361807, 361809, H05K 702, H05K 111, H01R 909

Patent

active

056662726

ABSTRACT:
A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component, such as a data acquisition device, a wireless communications device, an output device or driving devices for a clock circuit. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device.

REFERENCES:
patent: 4882657 (1989-11-01), Braun
patent: 5119269 (1992-06-01), Nakayama
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5222014 (1993-06-01), Lin
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5403782 (1995-04-01), Dixon et al.

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