Detachable adhesive compounds

Details Detachable adhesive compounds Detachable adhesive compounds

2005-02-15

2005-02-15

Yoon, Tae H. (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S401000, C524S423000, C524S431000, C524S440000, C524S441000, C252S06290R, C252S06251C, C252S062560, C252S06290R, C528S503000, C522S071000, C428S689000, C977S726000

Reexamination Certificate

active

06855760

ABSTRACT:
This invention relates to adhesive compositions of which the binder system contains nanoscale particles with ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric properties. The invention also relates to dissolvable adhesive bonds and to a process for dissolving adhesive bonds.

REFERENCES:
patent: 3564515 (1971-02-01), Gratian
patent: 3620875 (1971-11-01), Guglielmo, Sr. et al.
patent: 4083901 (1978-04-01), Schonfeld et al.
patent: 4176054 (1979-11-01), Kelley
patent: 4254201 (1981-03-01), Sawai et al.
patent: 4548862 (1985-10-01), Hartman
patent: 4635415 (1987-01-01), Schumacher et al.
patent: 4810799 (1989-03-01), Zanker et al.
patent: 4849262 (1989-07-01), Uhl et al.
patent: 4882399 (1989-11-01), Tesoro et al.
patent: 5064494 (1991-11-01), Duck et al.
patent: 5143987 (1992-09-01), Haensel et al.
patent: 5185422 (1993-02-01), Drouve et al.
patent: 5240626 (1993-08-01), Thakur et al.
patent: 5338611 (1994-08-01), Lause et al.
patent: 5391595 (1995-02-01), Clark, Jr. et al.
patent: 5574123 (1996-11-01), Bock et al.
patent: 5620794 (1997-04-01), Burkart et al.
patent: 5695901 (1997-12-01), Selim
patent: 5710215 (1998-01-01), Abend
patent: 5714238 (1998-02-01), Komagata et al.
patent: 5786030 (1998-07-01), Ahmed et al.
patent: 5800890 (1998-09-01), Myers
patent: 5820664 (1998-10-01), Gardiner et al.
patent: 5833795 (1998-11-01), Smith et al.
patent: 5846426 (1998-12-01), Boos et al.
patent: 5910522 (1999-06-01), Schmidt et al.
patent: 5925455 (1999-07-01), Bruzzone et al.
patent: 5985435 (1999-11-01), Czaplicki et al.
patent: 5994422 (1999-11-01), Born et al.
patent: 6004425 (1999-12-01), Born et al.
patent: 6011307 (2000-01-01), Jiang et al.
patent: 6183658 (2001-02-01), Lesniak et al.
patent: 6245177 (2001-06-01), Luhmann
patent: 6348548 (2002-02-01), Abend
patent: 6448338 (2002-09-01), Born et al.
patent: 6472475 (2002-10-01), Lanoye et al.
patent: 6591125 (2003-07-01), Buse et al.
patent: 6592745 (2003-07-01), Feldman et al.
patent: 6602989 (2003-08-01), Sadik et al.
patent: 6605200 (2003-08-01), Mao et al.
patent: 6610269 (2003-08-01), Klaveness et al.
patent: 6613794 (2003-09-01), Hoefgen et al.
patent: 6632899 (2003-10-01), Kol et al.
patent: 20030168640 (2003-09-01), Kirsten
patent: 158973 (1983-02-01), None
patent: 35 01 490 (1986-07-01), None
patent: 37 09 852 (1988-10-01), None
patent: 41 30 268 (1992-03-01), None
patent: 43 28 108 (1995-02-01), None
patent: 42 30 116 (1995-10-01), None
patent: 195 02 381 (1996-08-01), None
patent: 195 12 427 (1996-10-01), None
patent: 195 18 673 (1996-11-01), None
patent: 195 26 351 (1997-01-01), None
patent: 196 49 893 (1997-06-01), None
patent: 196 14 136 (1997-10-01), None
patent: 197 26 282 (1998-12-01), None
patent: 197 30 425 (1999-01-01), None
patent: 198 32 629 (2000-02-01), None
patent: 199 54 960 (2000-06-01), None
patent: 199 04 835 (2000-08-01), None
patent: 199 24 138 (2000-11-01), None
patent: 0 131 903 (1985-01-01), None
patent: 0 212 511 (1987-03-01), None
patent: 0 237 657 (1987-09-01), None
patent: 0 356 715 (1990-03-01), None
patent: 0 510 476 (1992-10-01), None
patent: 0 545 033 (1993-06-01), None
patent: 0 671 423 (1995-09-01), None
patent: 0 521 825 (1996-08-01), None
patent: 0 922 720 (1997-12-01), None
patent: 0 735 121 (2001-05-01), None
patent: 0 598 873 (2002-09-01), None
patent: 1087815 (1967-10-01), None
patent: WO 8701724 (1987-03-01), None
patent: WO 8809712 (1988-12-01), None
patent: WO 9412582 (1994-06-01), None
patent: WO 9805726 (1998-02-01), None
patent: WO 9805728 (1998-02-01), None
patent: WO 9851476 (1998-11-01), None
patent: WO 9903306 (1999-01-01), None
patent: WO 9907774 (1999-02-01), None
Kryszewski, et al., Nanostructured conducting polymer composites-superparamagnetic particles in conducting polymers,SYNTH. Met.94, pp. 99-104, XP000934280 (1998).
V. R. Sastri et al., Reversible Crosslinking in Epoxy Resins,Journal of Applied Polymer Science,39, pp. 1439-1457 (1990).
Kirk-Othmer, Encyclopedia of Chemical Technology, 3rdEdition, 15, Kapitel Microwave Technology, pp. 496-497.
R. V. Decahau et al., “Microwave Processing and Engineering”, VCH, Verlagsgesellschaft, pp. 34-44 (1986).
G. Habenicht, Kleben: Grundlagen, Technologie, Anwendungen, 3rdEdition, Chapter 2.3.4.4. (1997).
Testing of adhesives for metals and adhesively bonded metal joints; Determination of the shear strength of single lap joints in shear by tension loading, (DIN 53 283), pp. 1-5, Deutsches Institut fuer Normung e.V., Berlin, (Sep. 1979).
J. Ray Ballinger, “Paramagnetism”, Paramagnetic Material (1994-1996) at http://www.mritutor.org/mritutor/paragmag.htm.
J. Ray Ballinger, “Ferromagnetism”, Ferromagnetic Material (1994-1996) at http://www.mritutor.org/mritutor/ferromag.htm.
Raymond A. Serway, “Hysteresis”, Physics for Scientists and Engineers with modern Physics. Third Edition, Saunderts Golden Sunburst Series, pp. 852-862, 1992 (Abstract only, 2 pages) at http://www.ece.uic.edu/˜kcha/hysteresis.htm.
Jon Dobson, “Magnetism in Matter and Magnetic Biomaterials”, Centre for Science and Technology in Medicine, Keele University, Jan. 2000 at http://www.keele.ac.uk/depts/stm/magmaterials.html.
Jeff P. Anderson, et al., “Permeability and Hysteresis Measurement”, 2000 CRC Press LLC, at http://www.engnetbase.com.
Wikipedia, The Free Encyclopedia, “Ferromagnetism”, at http://en2.wikipedia.org/wiki/Ferromagnetism.
Wikipedia, The Free Encyclopedia, “Paramagnetism”, at http://en2.wikipedia.org/wiki/Paramagnetism.
Wikipedia, The Free Encyclopedia, “Superparamagnetism”, at http://wn2.wikipedia.org/wiki/Superparamagnetism.

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