Desoldering vat

Metal fusion bonding – Specialized pot

Patent

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Details

228 19, B23K 300

Patent

active

049796623

ABSTRACT:
A desoldering vat includes a narrow, elongated, solder pot filled with liquid solder which actually extends slightly above the pot due to the meniscus, and is used to desolder the multiple pins of electronic components, especially elongated components such as edge connectors, which could be as long as 14", with three rows of pins. Adjustable braces on both sides of the pot allow the worker to rest a circuit board against the brace and pot such that the depending pins of the pass-through pins of the components extend into the solder, with the solder in most instances touching the bottom of the printed circuit board. All the pins of the component are thus heated to molten solder temperature at once, permitting the easy removal of the component from the top of the board.

REFERENCES:
patent: 466580 (1892-01-01), Slemmer
patent: 3056015 (1962-09-01), Lovelace
patent: 3303983 (1967-02-01), Patrick et al.
patent: 3815806 (1974-06-01), Paxton
patent: 4456163 (1984-06-01), Zach
patent: 4506820 (1985-03-01), Brucker

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