Desoldering tool and method of desoldering leadless components

Details Desoldering tool and method of desoldering leadless components Desoldering tool and method of desoldering leadless components

1981-12-15

1984-03-13

Ramsey, Kenneth J.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 19, B23K 302, H05K 1300

Patent

active

044362420

ABSTRACT:
A desoldering tip, adapted to be attached to a standard pencil soldering iron, is formed with a recess adapted to closely fit over a leadless component soldered and adhered with an adhesive to a printed circuit board. Solder present in the recess attaches the component to the tool by molecular attraction. Once the solder and adhesive are melted, the component is readily lifted from the board with the tool. The component is then ejected from the tool.

REFERENCES:
patent: 3448911 (1969-06-01), Cushman
patent: 3649809 (1972-03-01), Halstead
patent: 3700155 (1972-10-01), Hermanns
patent: 3813023 (1974-05-01), Auray et al.
patent: 3815806 (1974-06-01), Paxton
patent: 4066204 (1978-01-01), Wirbser et al.
Drexinger, "Repair of Integrated Circuits" Western Electric Technical Digest, No. 3, Jul. 1966, p. 11.

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