Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Reexamination Certificate
2006-11-14
2006-11-14
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
Reexamination Certificate
active
07134590
ABSTRACT:
A desoldering sheath that comprises at least one hollow metal wire molded to conform to the tip of a desoldering tool. In one implementation, the desoldering sheath is formed using a hollow metal wire that is coiled around a male cone-shaped mold. The coiled, hollow metal wire is then compressed between the male cone-shaped mold and a female cone-shaped mold to cause the hollow wire to retain the coiled shape. In use, the desoldering sheath is placed on the tip of a desoldering gun or iron and then heated. The heated desoldering sheath, while still on the tip of the desoldering gun or iron, is then placed into contact with solder. This causes the solder to melt and the desoldering sheath captures the molten solder by using capillary action to draw the molten solder into the hollow metal wire.
REFERENCES:
patent: 3172382 (1965-03-01), Weglin
patent: 3263889 (1966-08-01), Fortune
patent: 3580462 (1971-05-01), Vanyi
patent: 3627191 (1971-12-01), Hood, Jr.
patent: 3881087 (1975-04-01), Nicosia
patent: 4137369 (1979-01-01), Chaikin
patent: 4323631 (1982-04-01), Spirig
patent: RE32086 (1986-02-01), Spirig
patent: 5072874 (1991-12-01), Bertram et al.
patent: 5083698 (1992-01-01), Forsha
patent: 5305941 (1994-04-01), Kent et al.
patent: 2002/0153404 (2002-10-01), Kaneko
Choi Criswell Hyunsoo
Choi Moon Gul
Cahoon Colin P.
Carstens & Cahoon LLP
Edmondson Lynne R.
O'Hagan Christopher P.
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