Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1976-11-19
1978-03-14
Kelly, Donald G.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
29426, 228 19, B23K 100
Patent
active
040787141
ABSTRACT:
In desoldering soldered joints, an electrically conductive wick or braid, used to absorb molten solder from the joint, is connected to a ground conductor of the circuit of which the joint forms a part, thus preventing possible damage to voltage-sensitive circuit components, for example FET's. A solder-absorbent conductive wick is provided with connecting means for connection either directly or through an intermediate conductor with a ground conductor of a circuit in which a joint is to be desoldered by the aid of the wick. Connection to the circuit conductor may be by way of a first electrical connector portion mating with a second connector portion on a circuit board carrying the circuit. The first connector portion may be mounted on a jig or locating fixture arranged to receive the circuit board. The wick may be wound on a spool and have its end electrically connected to a contact member of an electrical connector portion mounted on the spool and connected to the circuit by way of a wire having appropriate connector portions at its ends.
REFERENCES:
patent: 2972657 (1961-02-01), Stemke
patent: 3358898 (1967-12-01), Medkeff
patent: 3627191 (1971-12-01), Hood
patent: 3715797 (1973-02-01), Jackson
patent: 3895214 (1975-07-01), Winter
Kelly Donald G.
Laubscher Lawrence E.
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