Desoldering device

Details Desoldering device Desoldering device

1986-04-29

1988-10-25

Godici, Nicholas P.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

By fluid blast or suction

228 55, 219230, B23K 300

Patent

active

047797860

ABSTRACT:
A desoldering device is disclosed having a solder transferring tube in communication with a solder collection chamber and a pivotal handle attached to the solder collection chamber so that the handle may assume within a plane different angular positions with respect to the solder transfer tube without affecting proper orientation of the tubular front portion with respect to a workpiece. Moreover, a switch for controlling the vacuum is disposed on the handle and the handle is rotatable about its own axis so that the vacuum switch may have various orientations with respect to the plane in which the handle may assume different angular positions.

REFERENCES:
patent: 1053035 (1913-02-01), Houghland
patent: 1519246 (1924-12-01), Forshee et al.
patent: 1928522 (1933-09-01), Amundsen
patent: 2093527 (1937-09-01), Petti
patent: 2436552 (1948-02-01), Cooper
patent: 2745939 (1956-05-01), Lenk
patent: 2955187 (1960-10-01), Campo
patent: 2955188 (1960-10-01), Campo
patent: 2960591 (1960-11-01), Brillinger
patent: 3169499 (1968-02-01), Armanno
patent: 3211354 (1965-10-01), Dugard et al.
patent: 3392897 (1968-07-01), Siegel
patent: 3422247 (1960-01-01), Royston et al.
patent: 3480759 (1969-11-01), Sachs et al.
patent: 3842240 (1974-10-01), Wakita et al.
patent: 3965608 (1976-06-01), Schuman
patent: 3980218 (1976-09-01), Fortune
patent: 4178496 (1979-12-01), Fortune
patent: 4206864 (1980-06-01), Rauchwerger
patent: 4230250 (1980-10-01), Scheu, Jr.
patent: 4274176 (1981-06-01), Undin et al.
patent: 4469934 (1984-09-01), Isshiki et al.
patent: 4568819 (1986-02-01), Stacconi
patent: 4574994 (1986-03-01), Rauchwerger

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