Desoldering device

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces

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Details

228 565, 228191, 228264, B23K 300, B23K 304

Patent

active

047670479

ABSTRACT:
A device for removing a component from a substrate to which it is secured by solder. The device has a moveable member which defines a space to which suction can be applied. The space has an opening which can be positioned against the component so as to hold the latter to the moveable member by suction. Provision is made for applying heat to the solder to soften it. The moveable member is arranged such that the suction causes it to pull the component so as to remove it from the substrate when the solder is molten.

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patent: 4295596 (1981-10-01), Doten et al.
patent: 4426571 (1984-01-01), Beck
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4605152 (1986-08-01), Fridman
patent: 4610388 (1986-09-01), Koltuniak et al.
patent: 4620659 (1986-11-01), Holdway
patent: 4659004 (1987-04-01), Fridman

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