Desoldering device

Details Desoldering device Desoldering device

1983-07-29

1985-03-26

Crosby, Gene P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 561, 118406, B23K 300

Patent

active

045068208

ABSTRACT:
An apparatus for desoldering and soldering multipin components to or from printed circuit boards is described. A shallow large area solder pot, surrounded by a recessed area to catch overflow, in combination with a flexible mask is used to apply molten solder to a selected area of a printed circuit board to desolder or solder a selected device.

REFERENCES:
patent: 2964007 (1960-12-01), Buffington
patent: 3815806 (1974-06-01), Paxton

Affiliated with

Also associated with

Rating

Desoldering device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Desoldering device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Desoldering device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1290343