Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1989-09-14
1991-04-16
Heinrich, Sam
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228 21, 228 59, 219236, B23K 304, B23K 3047
Patent
active
050075748
ABSTRACT:
A desoldering tool has a removable cartridge and a base unit having an assembly interior including a solder collection chamber and a removable vacuum source for developing a vacuum in the bottom of the chamber under a removable porous solder retention pad, the cartridge having a temperature self-regulating heater therein and a tail pipe extending from a tip of the cartridge to a position above the solder collection chamber, and a vacuum seal between the cartridge and the base unit to maintain the vacuum and reduce transfer of heat from the tip.
REFERENCES:
patent: 3169499 (1965-02-01), Armanno
patent: 3584190 (1971-06-01), Marcoux
patent: 3588618 (1971-06-01), Otte
patent: 3690539 (1972-09-01), Geiger
patent: 3864014 (1975-02-01), Lynch
patent: 3884409 (1975-05-01), Kaufman
patent: 3970234 (1976-07-01), Litt et al.
patent: 4187972 (1980-02-01), Vella
patent: 4289953 (1981-09-01), Scheu, Jr.
patent: 4574994 (1986-03-01), Rauchwerger
patent: 4695713 (1987-09-01), Krumme
patent: 4701587 (1987-10-01), Carter et al.
patent: 4745264 (1988-05-01), Carter
patent: 4752673 (1988-06-01), Krumme
patent: 4771151 (1988-09-01), Pursell
patent: 4788404 (1988-11-01), Kent
patent: 4795870 (1989-01-01), Krumme et al.
patent: 4839501 (1989-06-01), Cowell
Carlomagno Michael
James Steven
Poostpasand Hamid
Heinrich Sam
Metcal Inc.
Rose Howard L.
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