Desoldering apparatus

Details Desoldering apparatus Desoldering apparatus

1981-09-14

1983-11-01

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228191, 228 56, 118406, B23K 300

Patent

active

044126417

ABSTRACT:
A device for desoldering electronic components from circuit boards has a soldering nozzle which produces a solder wave that is directed from below the circuit board against the component to be desoldered; thereby dissolving previous solder bonds. The component can then be lifted out from above and suction is applied from below to the now-opened bores of the circuit board, to remove residual solder from them. A new component can then be installed, using the same equipment.

REFERENCES:
patent: 3815806 (1974-06-01), Paxton
patent: 3834605 (1974-09-01), Coffin
patent: 3948212 (1976-04-01), Mayer
patent: 4066204 (1978-01-01), Wirbser et al.
patent: 4162034 (1979-07-01), Pavlas
patent: 4187973 (1980-02-01), Fortune

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