Metal fusion bonding – With means to handle work or product
Patent
1989-08-31
1990-10-16
Heinrich, Sam
Metal fusion bonding
With means to handle work or product
228 54, 228 55, 219229, B23K 300, B23K 302
Patent
active
049628780
ABSTRACT:
A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as the circuit component. At least a pair of integral sides along opposite edes of the top are bent normal to the top and are not further apart than the outside of the electrical leads on the opposite sides of the circuit component for good thermal contact therewith. The depth of the inside of the box is greater than the height of the top of the component so that there is no contact between the top of the box and the top of the component. The top of the box over the component is heated sufficiently to melt solder on the electrical leads. The box and component can then be lifted together from the printed circuit board. Alternatively, the desoldering may be made from a heat deformable metal so that in a cooler state the sides of the desoldering aid are further apart than the outside distance between electrical leads on the component and in a warmer state the sides are closer together than the outside distance between electrical leads on the component.
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Heinrich Sam
Plato Products, Inc.
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