Desmearing and plated-through-hole apparatus

Details Desmearing and plated-through-hole apparatus Desmearing and plated-through-hole apparatus

1986-02-24

1989-02-21

Lawrence, Evan K.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118503, 118719, 118729, 156345, C23C 1404, C23C 1402, C23C 1434, C23C 1456

Patent

active

048062251

ABSTRACT:
An integrated plasma desmearing and plated-through-hole apparatus for first plasma desmearing a printed circuit board and then plating through the holes of the plated circuit board by sputtering. The apparatus comprises a plurality of vacuum chambers serially interconnected together. Preferably, five vacuum chambers are provided including a loading chamber, a desmearing chamber, a plating preparation chamber, a plating chamber and an unloading chamber. Airtight isolation doors isolate each chamber from the others. A transport system is provided for serially transporting the printed circuit boards through the chambers.

REFERENCES:
patent: 3100637 (1963-08-01), Brown
patent: 4012307 (1977-03-01), Phillips
patent: 4172021 (1979-10-01), Gladish
patent: 4351697 (1982-09-01), Shanefield et al.
patent: 4425210 (1984-01-01), Fazlin
patent: 4587002 (1986-05-01), Bok
Cairns, M., Sputtering: A Surface Treatment for Economy and Fine Finish, Design Engineering, Nov. 1970, pp. 83-85.
Barber, G. F., Two-Chamber Air-to-Vacuum Lock System, IBM Technical Disclosure Bulletin, vol. 11, No. 7, Dec. 1968, pp. 757-758.
Catalog & "Torus.RTM." Sputtering Sources, Published by Enerjet, a division at Kurt J. Lesker Co., undated, pp. 1-14.

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