Designing a ball assignment for a ball grid array package

Details Designing a ball assignment for a ball grid array package Designing a ball assignment for a ball grid array package

2006-05-30

2006-05-30

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S831000, C029S846000, C174S255000, C361S803000

Reexamination Certificate

active

07051434

ABSTRACT:
A method for designing a routing pattern for electrical contacts on a printed circuit board by arranging contacts in an array of rows and columns on the printed circuit board, connecting groups of n columns of contacts to n−1 columns of vias disposed interstitially between the contacts, thereby forming a vertical channel that does not extend completely through the contact array. Connecting the vias to traces, and routing the traces to an outside edge of the via array through the vertical channel. Connecting groups of n rows of the contacts to n−1 rows of vias disposed interstitially between the contacts, thereby forming a horizontal channel that does not extend completely through the contact array, and intersects with the vertical channel. Connecting the vias to traces, and routing the traces to the outside edge of the via array through the horizontal channel.

REFERENCES:
patent: 5784262 (1998-07-01), Sherman
patent: 6198635 (2001-03-01), Shenoy et al.
patent: 6388890 (2002-05-01), Kwong et al.

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