Design of IC package test handler with temperature...

Details Design of IC package test handler with temperature... Design of IC package test handler with temperature...

2000-06-26

2002-03-26

Metjahic, Safet (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S1540PB, C165S080100, C165S080200, C165S080300, C165S080400

Reexamination Certificate

active

06362640

ABSTRACT:

TECHNICAL FIELD
The present invention relates generally to test systems for IC (integrated circuit) packages, and more particularly, to a low maintenance design of an IC package test handler having a chilled water jacket for controlling the temperature at the IC package.
BACKGROUND OF THE INVENTION
During manufacture of IC (integrated circuit) packages, the IC packages are tested for proper functionality, as known to one of ordinary skill in the art of IC package manufacture. Referring to
FIG. 1A
, an IC package test handler
100
of the prior art holds an IC package
102
to a test station such that a plurality of leads, including a first lead
104
, a second lead
106
, a third lead
108
, a fourth lead
110
, and a fifth lead
112
, contact a socket of the test station, as known to one of ordinary skill in the art of IC package manufacture. An IC package typically has more numerous leads in an array of leads, but five leads
104
,
106
,
108
,
110
, and
112
are shown in
FIG. 1A
for clarity of illustration. The IC package test handler
100
includes a sponge
114
for sealing in a vacuum suction for holding the IC package
102
.
During testing of the IC package
102
at the socket of the test station, the integrated circuit within the IC package
102
dissipates power during operation, and the IC package
102
heats up. However, during testing of the IC package
102
, a predetermined temperature may be desired at the IC package
102
. In addition, with excessive heating of the IC package
102
, the testing circuitry of the test station may be damaged.
Thus, the IC package test handler
100
includes a heating element
116
for heating the IC package
102
and a chilled water jacket
118
for cooling the IC package
102
. The chilled water jacket
118
is filled with chilled water that is circulated through the chilled water jacket
118
. Chilled water flows into the chilled water jacket
118
through a chilled water inlet hose
120
. Water becomes heated within the chilled water jacket
118
, and this heated water is disposed out from the chilled water jacket
118
through a heated water outlet hose
122
such that chilled water constantly circulates through the chilled water jacket
118
.
The chilled water jacket
118
is disposed within a test handler housing
124
which is comprised of aluminum in the prior art IC package test handler
100
. The heating element
116
is embedded within a test handler base
126
of the test handler housing
124
, and the test handler base
126
is integral with the test handler housing
124
in the prior art IC package test handler
100
. A temperature sensor
128
is also embedded within the test handler base
126
.
A first extension spring is comprised of a first extension spring portion
130
and a second extension spring portion
131
. Referring to
FIGS. 1A and 1B
, the first extension spring portion
130
is wound around a first screw
132
, and the second extension spring portion
131
is wound around a second screw
133
. The portion of the first extension spring between the first extension spring portion
130
and the second extension spring portion
131
is wound around a first hose fitting
134
. The first hose fitting
134
is disposed within the chilled water inlet hose
120
for directing chilled water into the chilled water jacket
118
.
A second extension spring is comprised of a third extension spring portion
135
and a fourth extension spring portion
136
. Referring to
FIGS. 1A and 1C
, the third extension spring portion
135
is wound around a third screw
137
, and the fourth extension spring portion
136
is wound around a fourth screw
138
. The portion of the second extension spring between the third extension spring portion
135
and the fourth extension spring portion
136
is wound around a second hose fitting
139
. The second hose fitting
139
is disposed within the heated water outlet hose
122
for directing heated water out of the chilled water jacket
118
. The first hose fitting
134
and the second hose fitting
139
are coupled to the chilled water jacket
118
and support the chilled water jacket
118
.
In the prior art IC package test handler
100
, an extending membrane
142
is stretched over the chilled water jacket
118
. A compressed air inlet
144
provides compressed air above the extending membrane
142
such that the extending membrane
142
extends down to push down the chilled water jacket
118
.
During operation of the prior art IC package test handler
100
, when the temperature at the IC package
102
as sensed by the temperature sensor
128
is below a desired temperature, the amount of compressed air through the compressed air inlet
144
is decreased such that the extending membrane
142
is retracted back and not pushing down the chilled water jacket
118
. In that case, the chilled water jacket
118
does not contact the test handler base
126
. In addition, for raising the temperature at the IC package
102
to the desired temperature, the heating element
116
embedded in the test handler base
126
is turned on to heat up the test handler base
126
. The heated test handler base
126
which contacts the IC package
102
in turn heats up the IC package
102
.
On the other hand, referring to
FIG. 2
, when the temperature at the IC package
102
as sensed by the temperature sensor
128
is above a desired temperature, the amount of compressed air through the compressed air inlet
144
is increased such that the extending membrane
142
extends down to push down the chilled water jacket
118
to contact the test handler base
126
. The chilled test handler base
126
which contacts the IC package
102
in turn cools down the IC package
102
. In addition, for lowering the temperature at the IC package
102
to the desired temperature, the heating element
116
embedded in the test handler base
126
is turned off.
In this manner, the temperature at the IC package
102
is controlled using feedback control. However, the prior art IC package test handler
100
may require highly skilled labor and cost for maintenance. For example, the extending membrane
142
is stretched uniformly across the test handler housing
124
for proper operation of the IC package test handler
100
. If the extending membrane
142
has a loose area, then the compressed air may further extend only that loose area of the extending membrane
142
such that the chilled water jacket
118
is not uniformly pushed down properly onto the test handler base
126
.
In addition, because the test handler housing
124
of the prior art is comprised of aluminum, heat is transferred easily through the test handler housing
124
, and the heating element
116
does not efficiently heat up the test handler base
126
. Furthermore, when the heating element
116
is heated with current flowing through the heating element
116
, when the insulating material surrounding the heating element
116
wears down, the heating element
116
may electrically short with the test handler housing
124
comprised of aluminum such that the heating element
116
no longer functions properly.
Additionally, because the test handler base
126
is integral with the test handler housing
124
, when a component of the test handler base
126
is inoperative, the whole IC package test handler
100
is dismantled to fix the test handler base
126
. Such a process is time-consuming, and renders the whole IC package test handler
100
inoperative while the test handler base
126
is being fixed.
Also, the first extension spring portion
130
, the second extension spring portion
131
, the third extension spring portion
135
, and the fourth extension spring portion
136
are extended and wound around the screws
132
,
133
,
137
, and
138
and around the hose fittings
134
and
139
with a proper amount of extension force for proper operation of the IC package test handler
100
of the prior art. The extension spring portions
130
,
131
,
135
, and
136
are extended with a proper amount of extension force such that the chilled water jacket

Affiliated with

Also associated with

Rating

Design of IC package test handler with temperature... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Design of IC package test handler with temperature..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Design of IC package test handler with temperature... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2867572