Design of high density structures with laser etch stop

Details Design of high density structures with laser etch stop Design of high density structures with laser etch stop

1995-06-06

1997-05-06

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating electrical conductor article

216 18, 216 65, 216 72, 216 78, 216 20, H01L 21268

Patent

active

056267711

ABSTRACT:
A multi-layer electronic circuit package including at least one electrically conductive plane, a first organic polymeric dielectric material having a first optical absorbency to an ablating wavelength of laser light, and a second organic polymeric dielectric material having a second optical absorbency to the ablating wavelength of laser light. The first and second optical absorbencies being different from each other. A first layer of one of the organic polymeric materials overlays at least one surface of the at least one electrically conductive plane and a second layer of a different organic polymeric material with a different optical absorbency to the material in the first layer overlays the first layer.

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