Design of high density structures with laser etch stop

Details Design of high density structures with laser etch stop Design of high density structures with laser etch stop

1994-06-02

1996-07-16

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

Of fluorinated addition polymer from unsaturated monomers

428209, 428323, 428325, 4284735, 2191216, 427531, B32B 900

Patent

active

055365795

ABSTRACT:
A multi-layer electronic circuit package including at least one electrically conductive plane, a first organic polymeric dielectric material having a first optical absorbency to an ablating wavelength of laser light, and a second organic polymeric dielectric material having a second optical absorbency to the ablating wavelength of laser light. The first material dielectric material absorbs wavelengths of light that are not the same as wavelengths of light that are absorbed by the second dielectric material. A first layer of the first or the second organic polymeric materials overlays at least one surface of the at least one electrically conductive plane and a second layer of the other of the first and second organic polymeric materials overlays the first layer.

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