Design for encapsulation of thermally enhanced integrated circui

Details Design for encapsulation of thermally enhanced integrated circui Design for encapsulation of thermally enhanced integrated circui

1993-03-25

1995-01-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 257720, 257787, 361713, 361813, H05K 720

Patent

active

053791878

ABSTRACT:
An improved packaging technique for packaging a thermally-enhanced, molded-plastic quad flat package (TE-QFP). An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate having a stepped area formed into the outer margins thereof. A lead frame has inwardly-extending fingers, which are attached to the stepped areas in the outer margins of the thermally conductive, electrically-insulated substrate. The stepped area centers the thermally conductive, electrically-insulated substrate and attached integrated-circuit die within the mold cavity so that the flow of plastic material is balanced over the top and bottom of the substrate to provide a molded package body substantially free of voids.

REFERENCES:
patent: 4707724 (1987-11-01), Suzuki
patent: 4835120 (1989-05-01), Mallik
patent: 4906802 (1990-03-01), Castleman
patent: 5065281 (1991-11-01), Hernandez
patent: 5083189 (1992-01-01), Sawaya
patent: 5136471 (1992-08-01), Inasaka
patent: 5157588 (1992-10-01), Kim
patent: 5225499 (1993-07-01), Kokaku et al.
patent: 5249101 (1993-09-01), Frey
patent: 5252783 (1993-10-01), Baird

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