Desiccant powder, its use for the drying of solid substrates, in

Details Desiccant powder, its use for the drying of solid substrates, in Desiccant powder, its use for the drying of solid substrates, in

1990-11-27

1992-08-11

Lovering, Richard D.

Coating processes

Plant member or animal specimen coating

252194, 47 576, 427204, 427214, 4273977, A01G 506, A01N 100

Patent

active

051377470

ABSTRACT:
The present invention relates to a novel desiccant powder and its use for the drying of solid substrates wetted by an aqueous or oily liquid such as, in particular, grains or seeds having undergone a coating or surface film-forming treatment.
According to the invention, this desiccant powder contains at least 50% by weight of absorbents with respect to the toal weight of the said powder, being preferably available in the form of particles having a mean diameter less than about 100.mu., the said absorbents being constituted of at least one aluminosilicate, in particular mica, to at least 25% by weight with respect to the total weight of the said absorbents.
This powder makes possible, in particular, the drying of colored grains or seeds.

REFERENCES:
patent: 3168796 (1965-02-01), Scott et al.
patent: 3567645 (1971-03-01), Dultz
patent: 4368591 (1983-01-01), Barke
patent: 4535098 (1985-08-01), Evani et al.
patent: 4556505 (1985-12-01), Fenn
patent: 4561995 (1985-12-01), Fenn
patent: 4615823 (1986-10-01), Tokuyama et al.
patent: 4797227 (1989-01-01), Tom et al.
patent: 4985061 (1991-01-01), Hughes

Affiliated with

Also associated with

Rating

Desiccant powder, its use for the drying of solid substrates, in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Desiccant powder, its use for the drying of solid substrates, in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Desiccant powder, its use for the drying of solid substrates, in will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-345335