Desiccant in a MEMS device

Optical: systems and elements – Optical modulator – Light wave temporal modulation

Reexamination Certificate

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Details

C359S224200, C359S291000, C359S292000, C359S295000, C359S298000, C359S318000, C359S512000, C359S513000

Reexamination Certificate

active

08040587

ABSTRACT:
A package structure and method for packaging a MEMS device is described. In one embodiment, the MEMS base device can include a substrate having a MEMS device formed thereon, a backplate, an exposed or activated desiccant disposed between the backplate and the transparent substrate, and a cover at least partially encapsulating said desiccant. In another embodiment, a MEMS display device can be manufactured by contacting the substrate and/or backplate with a cover which at least partially encapsulates a desiccant, joining the backplate and the substrate to form a package, and exposing or activating the desiccant.

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