Derived metric for monitoring die placement

Details Derived metric for monitoring die placement Derived metric for monitoring die placement

2008-06-24

2008-06-24

Kasenge, Charles R (Department: 2121)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S106000, C716S030000, C700S114000

Reexamination Certificate

active

07390681

ABSTRACT:
A method for monitoring die placement includes receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool. The measurements include center offset metrics associated with displacement of a center of the die. A plurality of corner offset metrics is determined based on the center offset metrics and dimensions of the die. A maximum one of the corner offset metrics is selected as a die placement metric. An out of tolerance condition with the die packaging tool is identified based on the die placement metric.

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