Deposition systems and processes for transport polymerization an

Details Deposition systems and processes for transport polymerization an Deposition systems and processes for transport polymerization an

1997-10-24

2000-07-11

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

118715, 118726, 118723MR, 118723ER, C23C 1600

Patent

active

060866799

ABSTRACT:
The described deposition systems are designed to accommodate new precursors and chemical processes used for transport polymerization and chemical vapor deposition. The systems consist primarily of a reactor, a liquid injector or gas mass flow controller, a cracker and a deposition chamber under sub-atmospheres pressure. The cracker utilizes one or more types of energy, including heat, photons, and plasmas. This invention is especially useful for preparing F-PPX (fluorinated poly(para-xylylenes) and other fluorinated polymer thin films for intermetal dielectric (IMD) and interlevel dielectric (ILD) applications in the manufacture of integrated circuits with features <0.25 .mu.m in size.

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