Deposition of silver layer on nonconducting substrate

Details Deposition of silver layer on nonconducting substrate Deposition of silver layer on nonconducting substrate

1995-03-06

1998-05-05

Nguyen, Ngoc-Yen

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428625, 428626, 428670, 428672, 428673, 428461, 428465, B32B 1504, B32B 2700

Patent

active

057471789

ABSTRACT:
A thin silver layer is deposited on the surface of a nonconducting substrate using an electroless process. The surface is cleaned and activated in aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt in the absence of an electric current, but in the presence of a deposition control agent. Optionally, the silver layer is stabilized with an aqueous solution of a platinum-group metal and/or gold. The resulting silver layer is uniform and of 2-2000 .ANG. thickness; it strongly adheres to the substrate.

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