Deposition of metals as interlayers within organic polymeric fil

Details Deposition of metals as interlayers within organic polymeric fil Deposition of metals as interlayers within organic polymeric fil

1984-07-23

1985-04-23

Andrews, R. L.

Chemistry: electrical and wave energy

Processes and products

204 20, 204130, 427256, 427282, 427283, 427 12, 427 35, 428458, C25D 700

Patent

active

045128553

ABSTRACT:
Metal interlayer deposition process for depositing a metal in its zero-valent state in a spatially-controlled manner within an organic polymeric film.

REFERENCES:
patent: 3407125 (1968-10-01), Fehlner
patent: 3549505 (1970-12-01), Hanusa
C. K. Chiang, Polymer, 22, 1454, (1981).
J. A. Bruce, J. Murahashi, and M. S. Wrighton, J. Phys. Chem., 86, 1552, (1982).
J. A. Bruce and M. S. Wrighton, J. Am. Chem. Soc., 104, 74, (1982).
P. G. Pickup, K. M. Kuo and R. J. Murray, J. Electrochem. Soc., 130, 2205, (1983).
R. W. Berry, P. M. Hall, and M. T. Harris, "Thin Film Technology", D. van Nostrand Co., Inc.; Princeton, NJ, 1968, pp. 1-17.
A. Roff and E. Weyde, "Photographic Silver Halide Diffusion Processes", The Focal Press, London and New York, 1972, pp. 13-31.
R. C. Haushalter and L. J. Krause, Thin Solid Films, 102, 161, (1983).

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