Apparel – General structure – Linings
Reexamination Certificate
2008-10-24
2010-12-07
Muromoto, Jr., Bobby H (Department: 3765)
Apparel
General structure
Linings
C002S243100, C002S905000, C607S115000, C219S211000
Reexamination Certificate
active
07845023
ABSTRACT:
Fibers, such as textile fibers, having electrical components deposited thereon. More particularly, one or more electrical components are formed directly onto the surface of at least one fiber. The fiber having the electrical component formed thereon may then be interlaced with other fibers to form a larger piece of fabric, which can be employed to produce an article of clothing. A group of transistors and piezoelectric components forming an accelerometer may be woven onto one or more natural or synthetic fibers. The fibers may then be employed as the warp, weft, or both, of a woven piece of fabric, or used to form a knitted piece of fabric. The fabric piece can then be cut and sewn to form a wearable item, such as a shirt, a pair of pants, a hat, or the upper piece of a shoe that includes the accelerometer.
REFERENCES:
patent: 3586597 (1971-06-01), Okuhashi
patent: 3632966 (1972-01-01), Arron
patent: 4723589 (1988-02-01), Iyer et al.
patent: 5555490 (1996-09-01), Carroll
patent: 5636378 (1997-06-01), Griffith
patent: 5655223 (1997-08-01), Cozza
patent: 5771492 (1998-06-01), Cozza
patent: 5906004 (1999-05-01), Lebby et al.
patent: 6006357 (1999-12-01), Mead
patent: 6080690 (2000-06-01), Lebby et al.
patent: 6210771 (2001-04-01), Post et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6472029 (2002-10-01), Skszek
patent: 6580959 (2003-06-01), Mazumder
patent: 6620645 (2003-09-01), Chandra et al.
patent: 6631290 (2003-10-01), Guck et al.
patent: 6853293 (2005-02-01), Swartz et al.
Office Action issued in continuation application, U.S. Appl. No. 10/077,548, dated Mar. 17, 2010.
Banner & Witcoff , Ltd.
Muromoto, Jr. Bobby H
NIKE, Inc.
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