Deposition of copper from electroless plating compositions

Details Deposition of copper from electroless plating compositions Deposition of copper from electroless plating compositions

1984-03-09

1985-06-25

Smith, John D.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427437, 4274431, 427404, 106 123, 106 126, C23C 302

Patent

active

045253900

ABSTRACT:
Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content and oxygen content. The process reduces plating void defects and reduces nodule formation.

REFERENCES:
patent: 2996408 (1961-08-01), Lukes
patent: 3485643 (1969-12-01), Zeblisky
patent: 3615732 (1971-10-01), Shipley
patent: 3615733 (1971-10-01), Shipley
patent: 3650777 (1972-03-01), Schneble
patent: 3844799 (1974-10-01), Underkofler
patent: 3900599 (1975-08-01), Feldstein
patent: 3959531 (1976-05-01), Schneble
patent: 4152467 (1979-05-01), Alpaugh
patent: 4160049 (1979-07-01), Narcus
patent: 4169171 (1979-09-01), Narcus
patent: 4448804 (1984-05-01), Amelio

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