Deposition of copper

Details Deposition of copper Deposition of copper

1974-11-06

1976-06-15

Esposito, Michael F.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427304, 427306, 427426, 427437, 106 1, B05D 304, B05D 310

Patent

active

039638421

ABSTRACT:
This invention relates to processes and compositions for the deposition of metallic copper on a catalytically activated surface by the controlled disproportionation of cuprous ions. Cupric tetraammino ions in aqueous solution are rapidly reduced to cuprous diammino ions and the latter are acted upon by the addition of an activator-modifier so as to bring about controlled disproportionation resulting in the deposition of metallic copper principally on the catalytically activated surface of a workpiece.

REFERENCES:
patent: 2759845 (1956-08-01), Hilemn
patent: 2783193 (1957-02-01), Nieter
patent: 2900274 (1959-08-01), Whitehurst
patent: 2922737 (1960-01-01), Moudry et al.
patent: 2963383 (1960-12-01), Weinrich
patent: 2967112 (1961-01-01), Kay et al.
patent: 2977244 (1961-03-01), Kay et al.
patent: 3093509 (1963-06-01), Wein
patent: 3403035 (1968-09-01), Schneble, Jr. et al.
patent: 3615732 (1971-10-01), Shipley, Jr. et al.
patent: 3645749 (1972-02-01), Paunovic

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