Deposition of boron-containing films from decaborane

Details Deposition of boron-containing films from decaborane Deposition of boron-containing films from decaborane

1989-02-13

1990-09-18

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 38, 427 531, 427 541, 4272551, 4272552, 427 431, B05D 512, C23C 1634, C23C 1614, C23C 1648

Patent

active

049577735

ABSTRACT:
Depopsition of a boron nitride film is carried out by introducing decaborane and dry nitrogen or ammonia into a plasma-assisted chemical vapor deposition chamber. The nitrogen or ammonia partial pressure should provide an excess over the decarborane pressures for example 200 milliTorr of N.sub.2 or NH.sub.3 and 50 MilliTorr of B.sub.10 H.sub.14. Other film layers can also be produced starting from decaborane.

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