Deposition of an extremely thin silver layer on a nonconducting

Details Deposition of an extremely thin silver layer on a nonconducting Deposition of an extremely thin silver layer on a nonconducting

1993-02-12

1994-06-14

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

Of metal

428465, 428434, 604264, 604265, 604905, B32B 2700

Patent

active

053209087

ABSTRACT:
Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group of gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

REFERENCES:
patent: 4054139 (1977-10-01), Crossley
patent: 4253463 (1981-03-01), Kim
patent: 4592920 (1986-06-01), Murtfeldt
patent: 4886505 (1989-12-01), Haynes

Affiliated with

Also associated with

Rating

Deposition of an extremely thin silver layer on a nonconducting does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Deposition of an extremely thin silver layer on a nonconducting , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Deposition of an extremely thin silver layer on a nonconducting will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1248242