Deposition method for balancing film stress

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

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C385S131000

Reexamination Certificate

active

06869816

ABSTRACT:
A film deposition method for an optical component is used to balance two side film stresses of a substrate. A predetermined number of layers of films is deposited on an upper side of the substrate, and then layers of films with similar thickness are deposited on a lower side of the substrate to balance side film stresses of the substrate.

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Suhir, E. “Analytical Modeling of the Interfacial Shearing Stress in Dual-Coated Optical FiberSpecimens Subjected to Tension”, Applied Optics, vol. 32, No. 16, 1963 pp3024-3034.

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