Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2005-03-22
2005-03-22
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C385S131000
Reexamination Certificate
active
06869816
ABSTRACT:
A film deposition method for an optical component is used to balance two side film stresses of a substrate. A predetermined number of layers of films is deposited on an upper side of the substrate, and then layers of films with similar thickness are deposited on a lower side of the substrate to balance side film stresses of the substrate.
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Chang Sean
Lu Chung-Ling
Coleman W. David
Delta Electronics , Inc.
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