Deposition fabrication using inkjet technology

Details Deposition fabrication using inkjet technology Deposition fabrication using inkjet technology

2007-12-18

2007-12-18

Lee, Michael G. (Department: 2876)

Registers

Records

Conductive

C428S195100, C252S500000, C436S138000

Reexamination Certificate

active

11397107

ABSTRACT:
A method of fabricating a circuit lead, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of substantially uniformly patterned micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a circuit lead. The invention also includes an electronic circuit comprising: (a) a substrate including a plurality of micropores that are substantially uniformly patterned; (b) a microchip; and (c) a circuit lead in electrical communication with the microchip and contacting the substrate, the circuit lead comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.

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PICTORICO Ink Jet Media: Ceramic Particle Coating, <<http://www.pictorico.com/ceramic.php>>, Pictorico USA, Inc., Oct. 25, 2004.
PICTORICO Ink Jet Media: Dot & Digital Pattern, <<http://www.pictorico.com/hot—digital.php>>, Pictorico USA, Inc., Oct. 25, 2004.

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