Etching a substrate: processes – Nongaseous phase etching of substrate – Substrate is multilayered
Patent
1994-01-24
1996-04-23
Bell, Janyce
Etching a substrate: processes
Nongaseous phase etching of substrate
Substrate is multilayered
216 35, 216 36, 216106, 427304, 427305, 427306, 427307, 427282, 4273831, 4273855, 427322, B05D 304, C23F 100
Patent
active
055095577
ABSTRACT:
A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:
REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3632388 (1972-01-01), Grunwald
patent: 3808028 (1974-04-01), Lando
patent: 3962495 (1976-06-01), Feidstein
patent: 3983267 (1976-09-01), Norris
patent: 4066809 (1978-01-01), Alpaugh et al.
patent: 4358479 (1982-11-01), Canestaro et al.
patent: 4448804 (1984-05-01), Amelio et al.
patent: 4532015 (1985-07-01), Boultinghouse et al.
patent: 4718972 (1988-01-01), Babu et al.
patent: 4861648 (1989-08-01), Kleinschmidt et al.
patent: 5137618 (1992-08-01), Burnett et al.
patent: 5215645 (1993-06-01), DiFranco et al.
patent: 5215646 (1993-06-01), Wolski et al.
patent: 5246564 (1993-09-01), Tamiya et al.
Jimarez, et al., Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils, Transactions of the ASME, Journal of Electronic Packaging, vol. 115, Sep., 1993, pp. 256-263.
Bhatt et al., Full-Additive Process for the Manufacture of Copper Bondable Surface Products, Reasearch Disclosure, Apr. 1991, No. 324, Kenneth Mason Publications Ltd., England.
Jimarez Lisa J.
Lawrence William H.
Markovich Voya R.
Owen Robert J.
Sambucetti Carlos J.
Bell Janyce
International Business Machines - Corporation
LandOfFree
Depositing a conductive metal onto a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Depositing a conductive metal onto a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Depositing a conductive metal onto a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2303159