Deposited multi-layer device

Details Deposited multi-layer device Deposited multi-layer device

1996-01-11

1997-10-07

Turner, Archene

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

359 58, 428216, 428336, 428408, 428698, 428701, G02F 11343

Patent

active

056745990

ABSTRACT:
The present invention provides a deposited multi-layer device with high reliability, which allows to reduce a weight, a production cost, and to avoid a peeling of a film, a crack and a curl of a substrate.
The present invention relates to a deposited multi-layer device formed on a plastic substrate which is coated with a film of a buffer layer being made of an inorganic material on at least one surface of said substrate, wherein a total stress of the buffer layer is not greater than +700 Pa.m and not smaller than -700 Pa.m.

REFERENCES:
patent: 5190807 (1993-03-01), Kimock et al.
patent: 5227196 (1993-07-01), Itoh
patent: 5319479 (1994-06-01), Yamada et al.

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