Denture adhesive including a solvent-free, high molecular weight

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

106 35, C08F22204, C09K 300

Patent

active

059004703

ABSTRACT:
Denture adhesive including a solvent-free, high molecular weight terpolymer of maleic anhydride, a C.sub.1 -C.sub.4 alkyl vinyl ether and isobutylene.

REFERENCES:
patent: 4358573 (1982-11-01), Verbrugge
patent: 4780499 (1988-10-01), Villarreal et al.
patent: 5037924 (1991-08-01), Tazi et al.
patent: 5082913 (1992-01-01), Tazi et al.
patent: 5221787 (1993-06-01), Robison et al.
patent: 5237027 (1993-08-01), Kawame et al.
patent: 5340918 (1994-08-01), Kittrell et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Denture adhesive including a solvent-free, high molecular weight does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Denture adhesive including a solvent-free, high molecular weight, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Denture adhesive including a solvent-free, high molecular weight will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1869940

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.