Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-06-29
2009-11-10
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S059000, C438S106000, C250S339020, C257S080000, C257SE21502
Reexamination Certificate
active
07615414
ABSTRACT:
The invention relates to dental radiological image sensors for intraoral use. What is described is a method of fabricating an image sensor, comprising steps for the collective production of a structure combining a semiconductor wafer (12), bearing a series of image detection circuits, and a fiber-optic plate (20) fixed to one face of the wafer, the semiconductor wafer being thinned in a step subsequent to the formation of the image detection circuits on the wafer, and external access contact pads (28) are produced on that face of the wafer which is not fixed to the fiber plate, said contact pads being for controlling the circuits and for receiving image signals coming from the sensor, the fiber-optic plate having a thickness such that it provides most of the mechanical integrity of the structure once the wafer has been thinned, and to do so right to the end of the collective fabrication, the assembled structure consisting of the wafer and the plate being subsequently diced into individual chips.
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Cambou Pierre
Fritsch Lionel
E2V Semiconductors
Ghyka Alexander G
Lowe Hauptman & Ham & Berner, LLP
Nikmanesh Seahvosh J
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