Special receptacle or package – For body treatment article or material – Dental
Reexamination Certificate
2005-10-18
2005-10-18
Bui, Luan K. (Department: 3728)
Special receptacle or package
For body treatment article or material
Dental
C206S368000, C433S173000
Reexamination Certificate
active
06955258
ABSTRACT:
Disclosed is a device and method for use in the dental implant industry. Generally, the device relates to packaging systems for dental implants that are capable of storing implants of different lengths and varying diameters. An embodiment of the package may be composed of a vial for housing a cushion. Located on the cushion is a sleeve for housing at least a portion of a dental implant. The sleeve and implant are covered by a sleeve cap whereby the sleeve cap is constructed to hold a healing screw. The packaging system also includes a lid for covering the healing screw.
REFERENCES:
patent: 2347567 (1944-04-01), Kresse
patent: 3346135 (1967-10-01), Haitsch
patent: 3481712 (1969-12-01), Bernstein et al.
patent: 4158256 (1979-06-01), Wiland et al.
patent: 4187609 (1980-02-01), Edelman
patent: 4465463 (1984-08-01), Hison Olde
patent: 4553942 (1985-11-01), Sutter
patent: 4600388 (1986-07-01), Linkow
patent: 4722688 (1988-02-01), Lonca
patent: 4856648 (1989-08-01), Krueger
patent: 4856994 (1989-08-01), Lazzara et al.
patent: 4955811 (1990-09-01), Lazzara et al.
patent: 5013242 (1991-05-01), Prezmecky
patent: 5030096 (1991-07-01), Hurson et al.
patent: 5062800 (1991-11-01), Niznick
patent: 5100323 (1992-03-01), Friedman et al.
patent: 5105690 (1992-04-01), Lazzara et al.
patent: 5108288 (1992-04-01), Perry
patent: 5158458 (1992-10-01), Perry
patent: 5213500 (1993-05-01), Salazar et al.
patent: 5254005 (1993-10-01), Zuest
patent: 5290171 (1994-03-01), Daftary et al.
patent: 5297561 (1994-03-01), Hulon
patent: 5302125 (1994-04-01), Kownacki et al.
patent: 5306309 (1994-04-01), Wagner et al.
patent: 5312254 (1994-05-01), Rosenlicht
patent: 5322443 (1994-06-01), Beaty
patent: 5338196 (1994-08-01), Beaty et al.
patent: 5368160 (1994-11-01), Leuschen et al.
patent: 5368483 (1994-11-01), Sutter et al.
patent: 5417570 (1995-05-01), Zuest et al.
patent: 5433330 (1995-07-01), Yatsko et al.
patent: 5437550 (1995-08-01), Beaty et al.
patent: 5453010 (1995-09-01), Klein
patent: 5462436 (1995-10-01), Beaty
patent: 5507463 (1996-04-01), Kobylinski et al.
patent: 5525314 (1996-06-01), Hurson
patent: 5538428 (1996-07-01), Staubli
patent: 5558230 (1996-09-01), Fischer et al.
patent: 5564924 (1996-10-01), Kwan
patent: 5569037 (1996-10-01), Moy et al.
patent: 5582299 (1996-12-01), Lazzara et al.
patent: 5622500 (1997-04-01), Niznick
patent: 5636991 (1997-06-01), Mays
patent: 5651675 (1997-07-01), Singer
patent: 5683464 (1997-11-01), Wagner et al.
patent: 5692904 (1997-12-01), Beaty et al.
patent: 5733124 (1998-03-01), Kwan
patent: 5755575 (1998-05-01), Biggs
patent: 5887707 (1999-03-01), Anascavage et al.
patent: 5904483 (1999-05-01), Wade
patent: 5961330 (1999-10-01), Hanson
patent: 5964591 (1999-10-01), Beaty et al.
patent: 5967305 (1999-10-01), Blonder et al.
patent: 5979643 (1999-11-01), Blonder et al.
patent: 5996779 (1999-12-01), Klardie et al.
patent: 6217332 (2001-04-01), Kumar
patent: 6247932 (2001-06-01), Sutter
patent: 6247933 (2001-06-01), Wagner et al.
patent: 2004/0043358 (2004-03-01), Howlett et al.
patent: 9014729.4 (1991-01-01), None
patent: 0 630 621 (1994-12-01), None
patent: WO 96/25895 (1996-06-01), None
patent: WO 97/20518 (1997-06-01), None
patent: WO 98/53755 (1998-05-01), None
patent: WO 98/52490 (1998-11-01), None
patent: WO 98/53755 (1998-12-01), None
Bernardo Angel
Bullis Grant
Howlett Charles W.
Bui Luan K.
Knobbe Martens & Olson Bear LLP.
Nobel Biocare AB
LandOfFree
Dental implant packaging system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dental implant packaging system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dental implant packaging system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3455391