Density improvement in integration modules

Details Density improvement in integration modules Density improvement in integration modules

1995-07-10

1998-04-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361761, 361764, 257686, 257777, H01R 2368

Patent

active

057371920

ABSTRACT:
Chip-like stacks of thinned chips are mounted in wells etched into a substrate. A"chip-like" stack is a stack of chips, which in the aggregate have a height approximately equal to that of a single conventional chip. These chip-like stacks are mounted in a variety of packages. In a preferred embodiment, the stacks are mounted in wells within the substrate of an integrated circuit and the stack is provided with a patterned overlay so that all the circuit connections can be made from the upper surface of the stack. The patterned overlay is protected by a planar insulator. A plurality of substrates may be stacked, one upon the other.

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