Densely packed electronic assemblage with heat removing element

Details Densely packed electronic assemblage with heat removing element Densely packed electronic assemblage with heat removing element

2005-08-16

2005-08-16

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S252000, C361S707000, C361S720000

Reexamination Certificate

active

06930885

ABSTRACT:
A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the at least one heat removing element for reducing heat of the heat generating component by absorbing heat from the at least one heat generating component.

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