Densely arranged duplex profile connector assembly

Electrical connectors – With supporting means for coupling part – Supporting plural – independent coupling parts

Reexamination Certificate

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Details

C439S326000

Reexamination Certificate

active

06821144

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to stacked type connector assembly, and particularly to the two densely arranged SO DIMM (Small Outline Dual In-line Memory Module) connectors adapted for mounting to a printed circuit board.
2. The Related Art
U.S. Pat. No. 6,126,472 having the same applicant and the same assignee with the invention discloses two SO DIMM connectors stacked with each other for receiving the two modules, respectively, wherein each of connectors includes upper row and lower row contacts respectively forwardly and rearwardly inserted into and then received in the upper and lower passageways of the corresponding housing. In the recent years, as mentioned in U.S. Pat. No. 5,964,606 having the same applicant and the same assignee with the invention, miniaturization is the trend for the connector design. Accordingly, it is desired to provide dense arrangement of the stacked SO DIMM connectors or other similar stacked horizontal type connector assembly.
SUMMARY OF THE INVENTION
According to an aspect of the invention, a connector assembly includes upper and lower connectors each essentially defining the basic structure of the SO DIMM connector and including an elongated main body with two latches extending forwardly at two ends thereof. The body of each of the upper and the lower connectors includes upper and lower passageways receives upper and lower contacts, respectively. The body of the upper connector is higher than that of the lower connector, and defines a recess in a front lower portion thereof to receive a rear portion of the body of the lower connector, whereby the front portion of the body of the upper connector and the rear portion of the body of the lower connector overlap each other in the vertical direction, thus result in dense arrangement of the assembly in comparison with the prior art arrangement where the two bodies of the upper and lower connector are spaced from each other in the front-to-back direction.
Another feature of the invention optionally provides dense and even contact arrangement under the bodies of the upper and lower connectors.
Another feature of the invention optionally provides capability of rearwardly installing the lower contacts of the upper connector from the recess wherein the contact portion of the lower contact of the upper connector is substantially located above the recess in the vertical direction.
Another feature of the invention optionally provides two pairs of different type contacts in upper and lower connectors, respectively, wherein each pair of contacts do not overlap each other in a lengthwise direction of the body so as to avoid overlapping the corresponding upper and lower passageways, thus assuring strength of the body.
Another feature of the invention provides the mounting pads, which are located around the latch portion far away from the body, with optionally the solder balls, so the connector assembly will not be tilted during mounting on the printed circuit board when the BGA (Ball Grid Array as mentioned in U.S. Pat. No. 6,220,884) contacts are used in this invention.


REFERENCES:
patent: 5641295 (1997-06-01), Koyama
patent: 5755585 (1998-05-01), Cheng et al.
patent: 5993234 (1999-11-01), Yodogawa
patent: 6095827 (2000-08-01), Dutkowsky et al.
patent: 6176737 (2001-01-01), Choy
patent: 6210194 (2001-04-01), Choy
patent: 6520802 (2003-02-01), Mitra
patent: 6612867 (2003-09-01), Wu

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