Dense superconducting bodies with preferred orientation

Details Dense superconducting bodies with preferred orientation Dense superconducting bodies with preferred orientation

1993-07-15

1995-01-03

Bell, Mark L.

Superconductor technology: apparatus, material, process

Processes of producing or treating high temperature...

Shaping or consolidating

505785, 264 65, 501152, 501151, 501123, C01G 2900, H01B 1300

Patent

active

053786823

ABSTRACT:
A description is given of a solid oxide-ceramic superconductor containing copper in the crystal lattice which is composed of crystals which are arranged essentially in parallel and intergrown with one another and which also contains, per 100 g of copper in the superconductor, 0.04 to 0.5 mol of CuF.sub.2 or KF, and of a sinter process for producing it. The copper-containing superconductor may be made up, for example, of bismuth, strontium, calcium or of bismuth, strontium, calcium, lead and also copper and oxygen.

REFERENCES:
patent: 5021399 (1991-06-01), Hsu
patent: 5055445 (1991-10-01), Belt
patent: 5077271 (1991-12-01), Hiskes
Jpn 01275492, Katsui, 6 Nov. 1989 (Abstract).
Jpn 63310762, Kamitori, 19 Dec. 1988 (Abstract).
Stavola, "Ramon Scrattering from Single Crystals . . . ", Physical Rev. B, vol. 38171, Sep. 1, 1988, pp. 5110-5113.
Matsuda, "Critical Current Density Bi-Pb-Sr-Cu-Cu-O . . . ", Jpn. Jnl. Appl. Phys., vol. 27(9), Sep. 1988, pp. L1650-L1651.
Asano, "Preparation of Highly Oriented . . . ", Jap. Jnl. Appl. Phys., vol. 27(9), Sep. 1988, pp. L1652-L1654.

Affiliated with

Also associated with

Rating

Dense superconducting bodies with preferred orientation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dense superconducting bodies with preferred orientation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dense superconducting bodies with preferred orientation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2211502