Dendritic treatment of metallic surfaces for improving adhesive

Details Dendritic treatment of metallic surfaces for improving adhesive Dendritic treatment of metallic surfaces for improving adhesive

1984-11-13

1985-11-05

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 321, 204 351, 204207, 204211, C25D 534, C25D 548, C25D 1700

Patent

active

045512108

ABSTRACT:
The present invention relates to a treatment for improving the laminate adhesion of metal and metal alloy materials, particularly copper and copper alloy foils. The treatment comprises electrolytically forming a plurality of dendrites on a surface of the metal or metal alloy material and bonding the dendrites thereto. The dendrites are formed on and bonded to the metal or metal alloy material surface by one or more treatment anodes positioned at an angle to the material being treated and a single current source.

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