Demountable heat sink

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

257718, H05M 720

Patent

active

056548761

ABSTRACT:
A demountable, and thus re-usable, conductive heat sink for dissipation of excess heat of an electronic component. The heat sink uses a T-bolt and T-slot for attachment to the electronic component and the printed circuit board, respectively. This attachment eliminates the typical concerns associated with the placement of traces on the PCB to accommodate the holes placed therein for the attachment of conventional heat sinks. The improved designed also facilitates demounting of the heat sink from the printed circuit board and the electronic component without damage thereto.

REFERENCES:
patent: 3867003 (1975-02-01), Morton et al.
patent: 4068368 (1978-01-01), DeBard et al.
patent: 4333101 (1982-06-01), York
patent: 4628990 (1986-12-01), Hagihara et al.
patent: 4636580 (1987-01-01), Neidig et al.
patent: 5305185 (1994-04-01), Samarov et al.
IBM TDB, "Double-Sided, Replaceable, Dendrite-Plated Interpose for Connector Applications", Oct. 1994, vol. 37, No. 10, pp. 35-36.

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