Demountable and repairable low pitch interconnect for stacked mu

Details Demountable and repairable low pitch interconnect for stacked mu Demountable and repairable low pitch interconnect for stacked mu

1996-12-23

1999-01-12

Abrams, Neil

Electrical connectors

Including elastomeric or nonmetallic conductive portion

361729, 257686, H05K 111

Patent

active

058578587

ABSTRACT:
Connection elements which, for example, may be used to facilitate interconnection to and stacking of electronic assemblies or may include an elongated conductive core, such as a wire or a hollow tube structure, coated with a layer of elastomeric material containing conductive particle such that the elastomeric material is conductive at least when compressed. The substrates of multi-chip modules (MCMs) have electrical connection sites in the form of metal-lined channels in the substrate edges, and the connection elements are pressed into the channels. Separate compression or clamping elements may be employed to enhance conductivity, as well as to facilitate external connections. The elongated conductive core may take the form of a hollow tube structure which may be expanded under internal pressure to compress the layer of elastomeric material. The compression elements may take the form of printed circuit boards. In alternative embodiments the connection elements may be clamped between conductive channels of side-by-side substrates or between opposed conductive channels of stacked substrates.

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"Assembly with Conductive Adhesives" by K. Gilleo, Proceedings of Surface Mount International 1994, San Jose, CA, pp. 279-288.

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