Demetallization of polymer/metal multilayer films by etching

Details Demetallization of polymer/metal multilayer films by etching Demetallization of polymer/metal multilayer films by etching

1996-06-11

1998-02-10

Gorgos, Kathryn L.

Etching a substrate: processes

Forming or treating material useful in a capacitor

216100, 216102, 216103, 216104, 216108, 216109, 3613061, 29 2503, H01G 4228, B21F 4100

Patent

active

057165327

ABSTRACT:
A method of improving the breakdown strength of polymer multi-layer (PML) capacitors is provided. The method comprises removing metal, specifically, aluminum, from the cut edge. This is done by either etching back the metal electrode layers in either basic or acidic solution or by anodizing the metal to cover that portion of the metal at the edge with an oxide. Removing the metal from the cut edge increases the breakdown strength of the PML capacitors by a factor of two or more.

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